chip level packaging
英 [tʃɪp ˈlevl ˈpækɪdʒɪŋ]
美 [tʃɪp ˈlevl ˈpækɪdʒɪŋ]
网络 芯片层次的封装; 构装
双语例句
- With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years.
随着芯片集成度及整机安装紧凑性的提高，计算机发热密度近年来一直呈指数级增长。 - There exist reliability issues dealing with the protection of front side and back side of the chip when using single chip packaging method. It is pointed out that wafer level packaging is better than single chip packaging method for protection of chip.
高量程加速度计采用单芯片封装方法时，存在芯片正面和背面保护的可靠性问题，更好的封装方法是采用圆片级封装。 - Microelectronic packaging is generally devided into three levels packaging. SCM and MCM are the first level packaging, are called chip level packaging;
微电子封装一般可分为三级封装，即用封装外壳（金属、陶瓷、塑料等）封装成单芯片组件（SCM）和多芯片组件（MCM）的一级封装，常称芯片级封装；